TagLiner RFID Inlay Die Bonding Machine

Product Description

The TagLiner is the highest capacity chip attach solution in the RFID industry. Applying best practices from the semiconductor industry, it greatly overcomes existing process bottlenecks. Each process station is using the same modular ultrafast index station, allowing for extremely precise positioning. Very high bonding quality can be achieved, demonstrated with a durability which proves to be best in class under mechanical stress testing. The TagLiner also targets the use of simpler and cheaper raw materials such as non-transparent substrates, like paper.

The TagLiner is marketed in cooperation between BW Papersystems and ITEC, with ITEC being the main contact. With the ADAT3XF TagLiner capable of 48000 UPH (units per hour), ITEC brings it´s proven technology to the RFID inlay market, enabling a productivity breakthrough at high quality and low maintenance. 

  • Unrivalled gross output of up to 48.000 uph
  • High throughput even at longer product pitches
  • Simple single-track design for easy operation
  • Shortest collet change times
  • Very short setup times due to simple curing system
  • High speed servo-controlled thermo compression curing system - better control of impact, force and height
  • High precision glue dispense system
  • Works with both transparent and non-transparent
  • Vision systems have no influence on uph



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Ease of operation and short set-up time, high capacity and precise positioning of the chip attachment are the key features we value in the TagLiner. - Arjun Aggarwal, Director SIVA IoT, India
Product Features

The TagLiner is the high volume RFID Inlay Manufacturing Machine.

Unrivalled Output

Unrivalled output of up to 48.000 uph even at longer product pitches.

Single-Track

Simple single-track design for easy operation.

Short Setup

Very short setup times due to simple curing system.

Various Product Types

Works with both transparent and non-transparent substrates.
  • Technical Data
  • Product Details
  • Options
Processing widthmax.6.5 in. / 165 mm
Unhampered machine speedmax.48000 uph (gross speed)
Glue dispense system Volumetric
Smallest chipmin.0.08 in. / 0,2 mm
High speed thermo compression curing system Servo-driven, one or two units
Wafer mapping All common formats supported
Wafer table alternatives 

8 in manual wafer change, 12 in/8 in automatic wafer change

TagLiner Process

Please contact us for more information.

TagLiner RFID Inlay Die Bonding Machine


BW Bielomatik presents TagLiner – the highest capacity Inlay Die Bonding machine in the RFID industry.

This RFID inlay manufacturing machine ensures extremely precise positioning, high bonding quality and usage of simpler and cheaper raw materials.

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