PassPort 2R Machine

Product Description

The PassPort 2R Machine laminates covers/e-covers/chip-inlays onto sewn layers and/or covers on inlays to produce e-covers. All styles of passports can be manufactured by combining the PassPort 2R with our PassPort 1, 3 and 4 machines.
Product Features

Passport Machine for Laminating


Lamination with cold and/or PUR Hotmelt glue.

Compliance with Standards

Suitable for (electronic) Machine Readable Travel Document (eMRTD) according to ISO and ICAO standards.

Productivity and Technology

High productivity and reliable production in terms of quality and output. Sophisticated technology for easy operation and maintenance.

Design and Modularity

Rigid design for increased life expectancy (>30 years). Modular layout in order to accommodate various types of passports and future upgrades.

  • Technical Data
  • Product Details
  • Options
PassPort 2-30R and PassPort 2-50R
Cycles/minMax. 30 or 50 Layers (double-up)
Layer thicknessmax. 4 mm
Sewn side250 mm - 330 mm
Unsewn side 160 mm - 224 mm
 PassPort 2R Sizes

PassPort 2R Basic Equipment

  • Flat feeder for sewn layers and/or
  • Rotary feeder for chip-inlays
  • Feeder for cover material, e-covers and/or chip-inlays
  • Pressing
  • Delivery in shingles

Add-on Options

  • Orientation of thread ends, pressing and welding
  • Seam gluing with cold glue or UV-curable glue
  • Secondary feeding and secondary lamination station for additional lamination, to get chip-inlay and cover onto sewn layer in a simple pass
  • Gold and/or blind embossing on cover before lamination
  • Pile press for improved adhesion especially with cold glue
  • Chip verification with automatic rejection of defective chip-inlays or e-covers (without interruption of production process)
  • Registration of chip-UIDs used and other track & trace features
  • Inline connection to PassPort 1 and PassPort 3 machines

PassPort Machines

BW Papersystems modular passport machine system offers customized solutions, including RFID e-passports storing biometric data, high capacity lockstitch sewing, and new cover and chip inlay lamination techniques. 

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Works Well With

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