The TagLiner is the highest capacity chip attach solution in the RFID industry. Applying best practices from the semiconductor industry, it greatly overcomes existing process bottlenecks. Each process station is using the same modular ultrafast index station, allowing for extremely precise positioning. Very high bonding quality can be achieved, demonstrated with a durability which proves to be best in class under mechanical stress testing. The TagLiner also targets the use of simpler and cheaper raw materials such as non-transparent substrates, like paper.